AMD CEO Pursues Samsung HBM

AMD CEO Pursues Samsung HBM

11 March 2026

What happened

AMD CEO Lisa Su will meet Samsung Electronics Chairman Jay Y. Lee in South Korea on March 18 to discuss securing high-bandwidth memory (HBM) supplies for AI chipsets. Su will also meet Naver CEO Choi Soo-yeon to explore broader cooperation: semiconductor supplies for data centres, sovereign AI infrastructure, and next-generation computing technologies. Samsung declined comment; Naver confirmed a meeting without agenda details. Su's visit coincides with Nvidia's GTC developer conference, March 16-19.

Why it matters

The direct engagement between AMD and Samsung leadership underscores the critical constraint of HBM supply on AI hardware development. Procurement teams and platform engineers face ongoing challenges in securing essential components, as the surging demand for AI systems intensifies competition for advanced memory chips. This follows recent reports highlighting SK Hynix's dominance in the HBM market, indicating a concentrated supply chain for a vital AI infrastructure component.

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Published on 11 March 2026

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AMD CEO Pursues Samsung HBM