Huawei has introduced a novel approach to enhance AI chip performance by bundling them, presenting a challenge to Nvidia's dominance in the sector. This solution aims to provide world-class computing power using locally manufactured chips, boosting China's self-reliance in AI. Huawei plans to launch upgraded Ascend AI chips over the next three years, rivalling those from Nvidia and AMD.
The new supernode computing cluster uses chipmaking processes available in China. Huawei's deputy chairman, Xu Zhijun, highlighted the company's commitment to meeting growing compute needs with a 'supernode + cluster' solution. The company is also developing the Ascend 91D, expected to launch in late 2025, potentially delivering 1,200 teraflops of FP16 performance.
This move aligns with Beijing's push for tech giants to reduce reliance on Nvidia chips. Huawei's advancements could empower China's AI ambitions amidst US restrictions. SMIC is testing China's first advanced AI chipmaking tool, potentially enabling Huawei to use 5nm chips in its flagship phones by 2026.