SK Hynix anticipates a robust 30% annual growth rate in the AI memory market through to 2030. This projection is driven by the increasing demand for high-bandwidth memory (HBM) chips, crucial for AI applications. The company expects the custom HBM market to expand significantly, potentially reaching tens of billions of dollars by 2030.
The demand for AI memory is fuelled by substantial investments from tech giants in AI infrastructure. SK Hynix is strategically collaborating with TSMC for HBM4 manufacturing to manage the complexities of base die production. The next-generation HBM4 chips, incorporating customer-specific logic, are expected to reduce customer churn.
SK Hynix is also investing in a new advanced semiconductor packaging plant and an AI research facility in Indiana, USA, to align with the growing demands of the AI memory sector. The company's focus on custom HBM aims to solidify its position in the market as general-purpose HBM becomes less common.
