Microsoft-backed startup VEIR is adapting its superconducting transmission line technology to address the increasing power demands of data centres. VEIR's superconducting cables are designed to deliver up to 3 megawatts of power, addressing the bottleneck caused by AI and high-density computing. Traditional copper cables struggle to efficiently handle the growing power needs of modern data centres, especially with the emergence of power-hungry platforms like Nvidia's Blackwell.
VEIR's solution offers a tenfold increase in power delivery compared to conventional cables, while also reducing space requirements and heat generation. This technology enables data centre operators to optimise designs, increase computing density, and meet the surging demands of AI-driven workloads. VEIR's cables can interconnect AI data centres, expand existing tie line capacity and facilitate the use of on-site generation assets. The company's products scale across voltages, offering solutions from 48V to 275kV.
By using superconductors and advanced cooling, VEIR's solutions achieve near-zero resistive losses and significantly lower voltage drop. This approach simplifies power distribution, offers flexible layouts, and reduces construction costs compared to traditional methods. VEIR's technology aims to provide reliable, high-capacity power delivery, design flexibility and seamless expansion of power capacity over time.
