What happened
ASML Holding unveiled an extreme ultraviolet (EUV) light source advance, boosting power from 600 watts to 1,000 watts. This technical improvement, achieved by doubling tin droplet frequency to 100,000 per second and using two smaller laser bursts, enables EUV machines to process 330 wafers per hour by 2030, up from 220. The company states this will yield 50% more chips and reduce per-chip costs, aiming to maintain its market lead against emerging US and Chinese rivals.
Why it matters
Chip manufacturing capacity will increase significantly, directly impacting supply chain stability and unit economics for semiconductor procurement teams. The 50% increase in chip output by 2030, driven by ASML's enhanced EUV lithography, reduces the cost per chip and accelerates wafer processing. This advance solidifies ASML's critical role, aiming to widen the technology gap for nations and foundries attempting to develop independent advanced chip production capabilities.
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